UK-based epitaxial wafer and substrate provider IQE has reported that the overall market recovery is weaker than anticipated.

台积电董事长魏哲家表示，尽管其公司在过去一年中将CoWoS的产能提升了超过两倍，但需求仍远超供应。这一现象尤为突出，因为人工智能领域的快速发展对计算能力的要求日益增加，而高性能的AI芯片往往依赖于先进的封装技术来提升其性能。中信证券进一步指出，先进封装技术已成为推动AI底层技术发展的重要方向，并且当前正处于全球市场的产能瓶颈之中。

随着人工智能技术的迅速发展，芯片行业正迎来前所未有的机遇。其中，先进封装技术尤为关键，尤其是台积电的CoWoS（Chip-on-Wafer-on-Substrate）技术，因其高效的性能和对AI芯片的支持，需求远超供给。近期台积电宣布，将在明年调涨CoWoS的价格，涨幅预计在10%至20%之间，显示出市场强劲的需求和有限的供给能力。 CoWoS技术的重要性 CoWoS封装技术能够将多个芯片直接封装 ...

Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based ...

根据摩根士丹利的最新报告，台积电的畸形增长背后是AI市场的蓬勃发展。随着AI技术的迅速崛起，多数芯片制造商如英伟达、AMD正在竞相确保其先进产品能够顺利投入市场。这种激增的需求使得台积电的生产线提前填满，导致产能供应严重不足。因此，此次涨价成为应对市场现实的无奈之举。

近日，兴森科技在互动平台上回应了投资者关于其FCBGA封装基板在CoWoS（Chip-on-Wafer-on-Substrate）先进封装工艺中的应用能力提问，指出该公司的封装基板完全能满足CoWoS技术的性能要求。这一消息无疑为需要高效能封装解决方案的芯片制造商注入了一剂强心针。

TSMC plans to increase production capacity by building multiple new semiconductor plants globally by 2025, with record-high ...

According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.

Silicon wafers are a building material for the majority of semiconductors, which are vital components of all electronic ...

Worldwide silicon wafer shipments increased 5.9% quarter-over-quarter to 3,214 million square inches (MSI) in the third ...

NexGen Wafer Systems is excited to announce the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean applications. SERENO combines high performance with exceptional ...

High-resolution X-ray diffraction can be used to optimize ion implantation for 4H-SiC substrates, improving wafer performance ...