According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.
Kulicke & Soffa's recently released APTURA™ FTC system, combined with technology innovations from ROHM, have successfully enhanced chip-to-wafer hybrid bonding with the innovative copper-first – ...
Supports a wide range of material configurations – source wafer, reel, or tray; to a target wafer, interposer, die or substrate – capable of supporting all die-to-die, or die-to-wafer based ...