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Innovative elastomer interconnect technology delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. Devices are mechanically ...

During the 15th China International Aviation and Aerospace Exhibition, Airbus held a press conference at the Zhuhai Space Center and awarded metal AM hardware company BLT a new A320 O-Ring work ...

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Abstract: A wide angle scanning circularly polarized (CP) concentric ring array (CRA) with large element spacing is proposed. With large element spacing, 75% transmitter/receiver components (T/Rs) can ...

Tucson, AZ USA Abstract : Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the ...

If a pad ring is developed to support only the simplest of functions ... The pads are, in turn, connected to the package through a solder ball in much the same way that a ball grid array (BGA) package ...

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Figure 3: An example fan-out of an STM32F412 in a WLCSP64 0.4 mm pitch package. The first BGA ‘ring’ is routed on the top layer (red), the second ring on the second layer (green) using L1–L2 microvias ...

Abstract: In this paper, a deep reinforcement learning (DRL) approach that optimizes the power/ground ball map design within the ball grid array (BGA) package of 3D-ICs considering ...