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我国首次突破沟槽型碳化硅MOSFET芯片制造技术
碳化硅 MOS 主要有平面结构和沟槽结构两种结构,目前业内应用主要以平面型碳化硅 MOSFET 芯片为主。 平面碳化硅 MOS 结构的特点是工艺简单,元胞一致性较好、雪崩能量比较高;缺点是当电流被限制在靠近 P 体区域的狭窄 N 区中,流过时会产生 JFET 效应 ...
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