TSMC has also set up factories in Arizona in the US and Kumamoto Prefecture in Japan, and they are gradually seeing results. TSMC would have advanced chip-on-wafer-on-substrate (CoWoS) packaging ...
During the US presidential campaign, then-Republican candidate Donald Trump repeatedly said that Taiwan “stole” the US’ chip industry. The reality is that Taiwan’s semiconductor industry plays a key ...
According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.
Kulicke & Soffa's recently released APTURA™ FTC system, combined with technology innovations from ROHM, have successfully enhanced chip-to-wafer hybrid bonding with the innovative copper-first – ...
Supports a wide range of material configurations – source wafer, reel, or tray; to a target wafer, interposer, die or substrate – capable of supporting all die-to-die, or die-to-wafer based ...